Thermal Design & CFD

We have 10+ years of experience in the following areas of Thermal Design and CFD in Electronics :

Thermal Design  : 

• Product Design (Mechanical, Embedded, and Electronics design)
• TOTAL Thermal Management of Electronics
  • Design / analysis & supply of Heat sinks, DC Fans, heat pipes, TECs
  • Thermal (CFD) analysis of electronics
  • Test & measurement (sensors, anemometers, wind tunnels)
  • Fabrication of prototypes, conventional & CNC machining

Electronics Cooling (CFD) :

Military : 

Different types of Modules and Chassis :

• Forced Air Cooled
• Conduction cooled
• Liquid Cooled (exploratory studies)

Telecom

• BTS
• ATCA
• Inverter (power backup)

Capabilities : 

Thermal Simulation : 

• Estimate junction/case Temperature and comment on thermal safety of the devices
• Determination of fan operating point
• Visualization of flow field – dead zones, heat sink bypass, etc

Optimization : 

• Heat sink – selection / custom design
• Selection of fans
• Selection and design air filters / vents etc

Mechanical Design of Card modules and Chassis

• ANSI/VITA standards – for military applications
• NEBS, NEMA and Euro standards – for telecom applications

Electronics Cooling :

• Intelligent fan tray
• CPU fan coolers
• DC brushless Fans & blowers
• Heat sinks (Al, Cu, extrusions, pin fins, heat pipes, vapor chamber or custom)
• Heat pipes
• Liquid cooling
• TECs & TEGs
• Test & measurement
• PCB fab, MC PCBs, Flex PCBs

Fabrication Support :

• Thermal management products
  Heat sinks (Al, Cu, extrusions, pin fins, heat pipes, vapor chamber or any other custom requirement), heat sink mounting hardware.
• Design and manufacturing of sheet metal and machined enclosures and other customized parts.
• Multi-layer PCB fab: Upto 16 layers and Flex PCBs.
• Metal Core PCBs for high density power conversion, motor control, flat panel displays, lighting, automotive and solar applications.
• Plastic injection molding & die casting.
• CNC Turing, Pressing and Radial Drilling

Major Industries Verticals Supported :

• Automotive
• Government (Defence, Derospace, Nuclear)
• Telecom, computer, medical electronics, white goods
• Engineering

Methodology/Process Followed :

• Inputs from customer / datasheets : Such as ambient conditions, power dissipation, board details (number of layers, thermal vias etc), device part numbers/ datasheets, material specification etc.
• Processing IDF files – Board layout and devices are modeled by importing and cleaning the IDF files.
• Modeling chassis / enclosures / covers
• If 3D CAD is available, the data is converted into formats/shapes that are usable in the analysis tool.
• Else, the model is constructed based on the specifications.
• Compact thermal models – DELPHI, 2R models that are available from the device vendor are incorporated in the board
• Improves the accuracy of junction temperature prediction.
• Information from datasheets can be also used to construct these network models.
• Meshing – number of cells and the sizing is decided based on the thermal / flow requirements.
• Mesh in-dependency checks are carried out to arrive optimum mesh density.
• Application of boundary conditions and numerical simulation of the model.
• Physics based selection of boundary conditions and numerical models
• Simulation results are verified by appropriate hand calculations.
• Result review, documentation and recommendation of design improvements
• Results are thoroughly analyzed to understand thermal bottlenecks, flow distribution etc.
• Contour / vector plots, quantitative data (temperature, flow rate etc) are documented
• Design improvements are suggested based on these observations
• Based on customer comments, the design changes implemented and optimization is carried out till the specifications are met.

Partial List of our customers  : Thermal Design & Electronics CFD :

• Automotive : Robert Bosch, Delphi, Visteon
• Electronics : Juniper Networks, EATON, CISCO, O/E/N, Amararaja Power, Aricent Group, Tejas Networks, Rancore Technologies
• Engineering : Infosys, HP, HCL, WIPRO, TCS, Lukup, Mindteck, Mistral, ProcSys, CoreEL, Aricent, CSG, Data Patterns, Honeywell, Reliance Info
• Govt : BEL, MTRDC, CDOT, DARE, ISAC, LEOS, LRDE, SAMEER, IGCAR

Tool Experience :

• FEA – Ansys, Midas NFX
• CFD – FloTHERM, Icepak, Fluent, Answer